Prof. Manos M. Tentzeris
Ed and Pat Joy Chair Professor
School of Electrical and Computer Engineering
Georgia Institute of Technology, USA
IEEE Fellow
Zero-Power Additively Manufactured FHE-Enabled Wireless/5G+/sub-THz Ultrabroadband Modules for Autonomous Integrated Sensor and Communication (ISAC) Systems: A Quantum Leap for AI-enabled IoT, Smart Agriculture, Industry 4.0+ and Smart Cities Applications?
In this talk, inkjet-/3D-printed antennas and antenna arrays, high-Q passives, interconnects, “smart” encapsulation and packages, RF electronics, RFIDs/mmIDs, microfluidics and sensors fabricated on glass, PET, paper and other flexible substrates are introduced as a system-level solution for ultra-low-cost mass production of Millimeter-Wave/Sub-THz Modules and Metasurfaces for Communication, Energy Harvesting and Sensing (ISAC) applications.
The presented approach could potentially set the foundation for the first truly convergent AI-enabled flexible wireless sensor ad-hoc ISAC networks of the future with enhanced cognitive intelligence and “rugged” packaging. Prof. Tentzeris will also discuss issues concerning the power sources of “near-perpetual” RF modules, including 5G+ enabled wireless power grids as well as energy harvesting approaches involving thermal, EM, vibration and solar energy forms.
The final step of the presentation will involve examples from shape-changing 4D-printed (origami) phased arrays, packages, reflectarrays and mmW wearable (e.g. biomonitoring) antennas and RF modules. Special attention will be paid on the integration of ultrabroadband (Gb/sec) inkjet-printed nanotechnology-based backscattering communication modules, opto-RF modules as well as miniaturized printable wireless (e.g. CNT) sensors for Internet of Things (IoT), 5G+ and smart agriculture/biomonitoring applications.
It has to be noted that the talk will review and present solutions for “5S Challenges” (Scalability, Sustainability, Speed, Security and Smartness) as well as future directions in the area of environmentally-friendly transient (“green”) RF electronics and “smart-skin” conformal sensors as well as massively scalable “tile-by-tile” RFID-enabled autonomous reconfigurable intelligent surfaces.